litePhone

Lab 3 – CAD Introduction

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Go step by step instead of showing a video and making them follow the steps add checkpoints for each student to check up on Specify slicer. Change lab report to a single page; add any problems you encountered.

Learn how to use simple Computer Aided Design (CAD) and Computer Aided Manufacturing (CAM) software to design and FDM print a simple enclosure for your litePhone.

Objective:

Gain hands-on experience with Computer-Aided Design (CAD) and Computer-Aided Manufacturing (CAM) by designing, slicing, and 3D printing a functional enclosure for your litePhone project. This lab bridges the gap between software/hardware integration and physical product design—a crucial aspect of embedded systems development.

Part 1 – CAD Modeling

You will use a beginner-friendly CAD tool like Tinkercad, Fusion 360, or FreeCAD to design a case for your ESP32-based litePhone. Your design must consider the size and layout of your hardware.

Requirements:

  • Dimensions must match your TFT screen, ESP32 DevKit, and any other mounted modules (buttons, battery, SIM card slot, speaker, etc.).
  • The enclosure must:
    • Be a two-part shell (top and bottom)
    • Include slots to secure components
    • Have cutouts for the screen, USB port, power/reset buttons, and ventilation if needed
    • Be printable on an FDM printer

🏆 Challenge

Research how to design snap-fit mechanisms or friction-fit lids. Try to implement one in your design!

Part 2 – CAM Workflow

Use a slicer like PrusaSlicer, Ultimaker Cura, or Bambu Studio to prepare your STL for FDM printing.

Steps:

  1. Export your model from the CAD tool as an .STL file
  2. Import into your slicer of choice
  3. Preview and export the G-code
  4. Print using the lab’s 3D printer or submit the file for instructor printing

🏆 Challenge

If supports are needed for overhangs, try modifying your model to eliminate them instead. Document your reasoning.

Part 3 – Assembly and Testing

Once printed:

  • Test the fit of each component
  • Identify any tolerance issues
  • If the screen or USB doesn’t align, revise and reprint
  • You should aim for snug but non-damaging fits

Submit the following:

  1. CAD File (.f3d, .step, or equivalent)
  2. G-code/Slicer File
  3. Photos of:
    • Assembled Enclosure
    • Internal View (open shell with components)
  4. Short report (1–2 pages) including:
    • Overview of your design
    • Design decisions (cutouts, fastening, part placement)
    • Any iterations and what changed
    • Lessons learned

Grading (100 Points)

  • CAD Design matches hardware (accurate dimensions, cutouts) (20 Points)
  • Printability and slicer setup (20 Points)
  • Physical print quality and usability (20 Points)
  • Functional fit of components (20 Points)
  • Lab Report comprehensiveness and insights(20 Points)

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